After performing the shorts and opens test the in-circuit tester tests each component on a PCB assembly one at a time.
短路、开路测试完成以后，在线测试仪需要在同一时间对印刷电路板上的每一个器件进行测试。
PCB with highly concentrated component, ( bottom is copper tinsel) that is the absolute point of measurement.
零件密集区之PCB（下有铜箔层），为板温量测点。
The quality of printed circuit board (PCB), what is as an important component of modern electronic equipment, makes a direct impact on product performance.
电路印刷板PCB板作为现代电子设备的重要组成部分，其质量直接影响到产品的性能。
The second substrate includes a power plane deposited at a position of a component mounted to the printed circuit board (PCB) to transmit power to the component.
第二基板包括电力平面，该电力平面安置在组件的被安装到印刷电路板的位置处以向组件传输电力。
The composite video, YC component analog video signals such as AD conversion to obtain digital image signals, to extract the synchronization and clock signals. (2) Embedded Systems PCB drawing.
将复合视频、YC分量等模拟视频信号进行AD转换以获取图像的数字信号，同时提取其中的同步和时钟信号。
This paper aimed at testing requirement of digital circuits contain memory chips during maintaining PCB, proposes a complex component model of ROM and RAM from testing angle.
本文针对实际维护PCB板中对含存储器模块的电路系统的测试需求，从测试角度对ROM和RAM建立一种复杂器件模型。
Because of no any PCB (Print Circuit Broad) making and component welding process during development of flexibility functions, a powerful data acquisition circuit can be designed in a short time.
在电路设计中没有传统的PCB制作和电子元器件的焊接工序，整个专用数据采集电路系统设计可在不到一天时间内完成。
Relay. Rating code 30a. Component none. Contact form 1 form C. Coil voltage 12. Mounting option PCB.
继电器。评价代码30A。组件没有。联系表1的形式c。线圈电压12。安装选项的PCB。
The sensor itself is only a copper pad on the PCB, not an actual component.
传感器本身只是PCB上的一个铜制衬垫，而非一个真实的器件。
In PCB resistor is very important component which is damaged easily and of great quantity, they determine the quality of whole production to a great extent.
电阻是印刷电路板上数量多且易损坏的元器件，它们对整个产品的质量水平有着十分重要的影响。
In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
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