SEM inspection results obtained on patterned wafers show the cleanliness, good profile and CD retention of the structures after the He:H2 plasma strip and subsequent wet cleans.
在有图形的片子上得到的扫描电镜检查结果显示了在等离子去胶和随后的湿法清洗后的清洁度、良好的图形轮廓和图形结构的关键尺寸保持情况。
SEM inspection results obtained on patterned wafers show the cleanliness, good profile and CD retention of the structures after the He:H2 plasma strip and subsequent wet cleans.
在有图形的片子上得到的扫描电镜检查结果显示了在等离子去胶和随后的湿法清洗后的清洁度、良好的图形轮廓和图形结构的关键尺寸保持情况。
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