The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
In addition, we have also added some specific injection moulding processes, such as pad printing, hot blade, ultrasound welding, mechanical assembling and testing.
除此之外，瓦诺科技还添加了一系列配套的特色工艺，如移印、热焊接和超声波焊接，机械装配与测试等。
In addition, we have also added some specific injection moulding processes, such as pad printing, hot blade, ultrasound welding, mechanical assembling and testing.
除此之外，瓦诺科技还添加了一系列配套的特色工艺，如移印、热焊接和超声波焊接，机械装配与测试等。
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