In this paper, the inspecting system based on computer vision techniques is designed to inspect the packaging precision of a new type headplate.
本文针对磁头感应探头基座的封装精度检测设计了基于计算机视觉技术的自动化检测系统。
A new planar parallel positioning mechanism is presented, which can be used as the high-speed and high-precision table in the chip-packaging application.
面向芯片封装领域对高速高精度平台的需求，提出一种新型平面并联定位机构。
A new type of inverter of resistance seam welding power supply was developed for precision welding in device packaging.
电阻缝焊在器件封装等应用中要求电源具有较高的精密性。
This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives.
本文讨论纳米精确度光学对准技术，以用于采用热固化树脂的微光学包装。
This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives.
本文讨论纳米精确度光学对准技术，以用于采用热固化树脂的微光学包装。
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