A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.
本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。
A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.
本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。
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