The review package is distributed to the reviewers -- that is, the team lead and up to two other developers, depending on code complexity.
评审包被分发给评审人员 —也就是根据代码的复杂程度分发给团队领导和其他的两个开发人员。
Specifying the interface explicitly might seem a bit constraining and lead to the need to change the XML when the interface is renamed or moved to another package.
显式地指定接口似乎有点限制，且在重命名接口或将接口迁移到另一个程序包时需要更改xml。
You might also look at the com.ibm.cademo.sl.comp.leadbrow package included with the Lead Manager example for an example.
您可以看看LeadManager示例附带的 com.ibm.cademo.sl.comp.leadbrow包，它提供一个例子。
We also show how, when combined with the WSMediations package sample code, this can lead to very rapid development of powerful SIBus mediation flows.
我们还将展示，在与软件包示例代码组合时，采取这种方式可以迅速开发出功能强大的SIBus中介流。
Lead package material supplier and packing centre technical qualification.
负责包装材料供应商和包装中心的技术认证。
Review on planning report settings periodically, make updates on lead time, min. order, product package and price settings.
定期审核月度定货计划报告的设置，更新到货期限，最小定单，产品规格和价格等设置。
In addition, the lead and the IC package add inductance as well. Multiple capacitors with low ESL (Equivalent Series inductance) should be used to improve the decoupling effect.
随着频率增加，理想电容的电抗会接近零。然而，这是不可能的，市场上没有这样理想的电容。此外，铅和IC封装也会增加电感。应该用多个低esl 。
If the package contained details deemed effective for the economy, it could lead to investors stopping buying of gold and moving out of the safe-haven gold market.
假若该方案出台后被认为对经济有利，投资者或会暂停购入黄金，把资金撤离这个资金避难市场。
After data bag reachs some main engine, the net card of this lead plane can receive this data package first, undertake checking.
当数据包到达某台主机后，这台主机的网卡会先接收这个数据包，进行检查。
Lead shipment package test, team work with customer on package improve.
主导出货包材测试，与客户检讨包装改善方案；
It is permissible to use additives, such as bags of lead shot, to achieve the requisite total package mass, so long as they are placed so that the test results are not affected.
允许使用添加物，如铅粒包，以达到要求的包件总重量，只要它们放的位置不会影响试验结果。
The modular structure of all of the units can lead to a significant increase in total process flexibility, obtain the best package quality and improve the economic efficiency.
所有功能单元的模块化结构可显著地提高生产过程的灵活性获得最佳的筒子质量，进一步提高经济效益。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Devising a credible austerity package could lead people to regard their economic future with less trepidation.
但是，如果紧缩政策计划周全、能获得大众信任，那么公众就不会对经济前景感到恐慌。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Modern packaging Industry: Some packaging enterprises have taken the lead in Wuhan City, such as Shanghai Zijiang Group, Zhuhai Zhongfu, Wuhan Xinte Package, Kangli Package.
现代包装产业：主要有上海紫江集团、珠海中富、武汉新特包装、康丽包装等，新兴的现代包装产业占据全市主导地位。
Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
铅含量(以重量计)在80%到85%之间、連接插脚与微处理器封装的含兩个元素以上的焊料中的铅。
All leads are coated with 100% matte tin, and there is no lead inside the package.
所有的引脚均镀以100%雾锡，封装内无铅存在。
Leads battery package design, technical standard and specification development to meet project needs in quality, cost, lead-time and capacity.
负责电池包装设计，确认技术标准和规格以满足项目在质量，成本，周期时间和生产能力上的要求。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
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