A new name-object association will be introduced in the current naming context (Package, Class, or Topic) in case an object is returned by the method.
如果由该方法返回对象，则会在当前的命名环境(Package、Class或Topic)中引入新的名称-对象关系。
Japan's stimulus package, introduced in the wake of the financial crisis, is likely to have kept domestic demand bubbling.
日本在金融危机后采取的经济刺激措施将持续扩大内需。
The application software package of Ocean Data View (ODV) is introduced in this paper.
对OD V这一海洋数据视图应用软件包作了介绍。
The solution of automatic package sorting and listing based on RS - 485 and UDP is introduced.
提出了基于RS-485及UDP的邮包自动分拣与邮单自动生成系统的解决方案。
In chapter 2, the design theory of head-end TS package processor is introduced in whole. The scheme is discussed and the problems needed to resolve is confirmed.
第2章从整体上介绍了TS流包处理器的设计原理，论证了设计方案，明确了要解决的问题。
The situation of rolled steel product's gauge of AISC is investigated systematically. The gauge, package quality and mark of rolled steel product being investigated are introduced.
对鞍钢钢材定尺状况做了系统调查，介绍了调查到的钢材定尺情况和钢材包装质量情况及钢材包装标志情况；
Intelligent package MJCAPP developed for aircraft part forming die process planning is introduced in this paper.
本文介绍了针对飞机成形模具工艺而开发的MJ CAPP智能软件包。
A software package for fast computation of electromagnetic scattering and radiation characteristics of large complex perfect conducting object is introduced in this paper.
介绍了一种可用以快速计算任意形状的电大尺寸导体目标散射和辐射特性的软件包。
The application software package of Ocean data View (ODV) is introduced in this paper. The emphasis is on its main characteristic, data visibility pattern, user interface, and its general function.
对OD V这一海洋数据视图应用软件包作了介绍。着重介绍了ODV的主要特点、数据可视化模式、用户界面及其功能概要。
The selection of package subtrate is also introduced, For mass production of integrated circuits and microwave modules. packaging is very critical in terms of either perform…
在集成电路和微波模块批量或规模生产中，无论就性能还是就成本而言，封装技术都是值得重视的关键技术。
The selection of package subtrate is also introduced, For mass production of integrated circuits and microwave modules. packaging is very critical in terms of either perform…
在集成电路和微波模块批量或规模生产中，无论就性能还是就成本而言，封装技术都是值得重视的关键技术。
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