Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
讨论与此种LED封装性能密切相关的议题：基础的芯片技术、合适的的封装设计和初级光学元件。
Discussed are the crucial components for the performance of this LED package as the underlying chip technology, the suitable package design and the fitting primary optics.
讨论与此种LED封装性能密切相关的议题：基础的芯片技术、合适的的封装设计和初级光学元件。
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