The electric characteristic parameters of package for high speed ASIC include propagation delay, characteristic impedance, cross talk, parasitic inductance and capacitance.
高速ASIC封装的电性能参数包括传输延迟、特性阻抗、信号串扰以及封装电感和电容等。
Reed relays are ideal for applications requiring low and stable contact resistance, low capacitance, high insulation resistance, long life and small package size.
对于稳定低接触电阻、低电容、高绝缘电阻、长寿命和小组装尺寸的切换应用而言，干簧继电器为最理想的选择。
Reed relays are ideal for applications requiring low and stable contact resistance, low capacitance, high insulation resistance, long life and small package size.
对于稳定低接触电阻、低电容、高绝缘电阻、长寿命和小组装尺寸的切换应用而言，干簧继电器为最理想的选择。
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