The Radar package board is an one-sided, high frequency board, which is mixed rags with multiple kinds of surface mounting components.
雷达组件板是多品种器件表面混装的单面高频板。
The World Bank’s earthquake assistance is part of a four-year, US$6.5 billion financing package for Pakistan discussed by the World Bank’s Board of Executive Directors on June 1.
世界银行的地震援助是世界银行执行董事会6月1日讨论的为巴基斯坦提供的四年期65亿美元资助包的一部分。
As for Mr Jha, Motorola's board seems to have ignored the shot fired across its bow by shareholders last year, when over one-third of them opposed his pay package.
至于Jha先生，摩托罗拉的董事会似乎忽视了去年股东们严正的反对态度，当时有超过三分之一的股东反对他的薪酬方案。
AIG's board approved the rescue package at a late-night meeting.
在深夜举行的会谈中，AIG董事会最终接受了这次营救计划。
This article introduces, the developing method of embedded real time system's BSP (board support package), including introduction of concept, develop method, test method.
简单介绍了嵌入式实时操作系统的板级支撑包的开发，包括概念，开发方式，开发流程，测试方式的介绍。
Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package.
基于英特尔x79高速芯片组的主板支持即将在距桥的LGA2011封装- E的爱好者处理器。
And combine the function of optical network management module, writing some board support package (BSP). Designing the software based on this operating system and BSP on the whole finally.
并结合光管理模块的具体功能，编写了一部分板级支持包(BSP)，最后从总体上给出了基于此操作系统的软件设计。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
Now that we have a working message board package, it is time to think about our friends overseas and the fact that not everyone can speak English.
现在我们有一个可以正常工作的软体包，如今我们需要替我们的海外朋友想想了，事实上不是每个人都能讲英语。
The base paper board for compound soft package is a high-tech, high profit and high market potential product with low raw material price.
复合软包装原纸板是个低价原料、高科技、高利润的产品，具有较大的市场潜力。
Single amplifiers are available in SOT-23 packages and duals in a 10 Ld MSOP package for applications where board space is critical.
单放大器提供SOT - 23封装，并在10引脚MSOP封装的应用电路板空间是至关重要的对偶。
The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
The material is hopefully used as novel printed circuit board and package material of electronic components.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
Our message board package does a really bad job with providing help up to this point.
我们的消息栏包在提供帮助这一点上无疑做得很差。
Board Support Package (BSP) is lucubrated and the file structure of BSP is analyzed and summarized.
对系统板级支持包bsp进行了深入的研究，分析和总结了BSP的文件结构。
The development of Board Support Package (BSP) is carried out.
进行了系统板级支持包BSP的开发。
Gantry robots are widely used for precision manufacturing tasks such as circuit board assembly and semiconductor end-package et al.
拱架机器人广泛地应用于各种精密制造领域，例如表面贴装设备、半导体后封装设备等。
A package for mounting an integrated circuit chip to a circuit board or the like is provided.
提供在电路板等上安装集成电路芯片的封装。
The reliability of solder interconnections is dependable on the dynamic response of the board-level package.
为板级封装动态响应分析和焊料微互连应力分析提供了基础。
This software can be used for package -, board - or system-level CFD simulation, including natural and forced convection and radiation heat transfer.
该软件可用于封装，电路板及系统级CFD模拟，包括自然对流、强制对流和辐射传热。
A homemade 3d filling simulation package-HSCAE 3drf was applied to optimize the mold structure and process of the front-board of Haier's net-air-condition.
应用国产三维流动模拟软件HSCAE3drf对海尔空调前面板的注射模具结构及工艺进行优化。
One of the key questions is: What role does the solder alloy play in the LED package-on-board assembly reliability?
一个关键性问题：焊接合金在焊接led于线路板的可靠性中担当者什么角色？
We are awaiting your instructions regarding labeling to each package for shipment on board m. v. Red Star.
我方正详待贵方有关装“红星”号船外包装标签的指示。
The 3-d finite element model is built for the modal analysis of board-level package.
建立了板级封装的三维有限元模型并进行模态分析。
The 3-d finite element model is built for the modal analysis of board-level package.
建立了板级封装的三维有限元模型并进行模态分析。
应用推荐