The insert comprises a first organic polymer and the over-molded outer component comprises a second organic polymer.
所述嵌件包括第一有机聚合物，所述重叠注塑的外部组件包括第二有机聚合物。
An over-molded thick wall part, an insert used in forming the over-molded thick wall part, and a method of forming over-molded thick wall parts.
本发明涉及重叠注塑的厚壁部件，用于形成重叠注塑的厚壁部件的嵌件，以及形成重叠注塑的厚壁部件的方法。
The over-molded package, holds together a samarium cobalt pellet, a pole piece and a true zero-speed Hall IC that has been optimized to the magnetic circuit.
在超模压封装，拥有一个共同钐钴颗粒，极片和一个真正的零速霍尔IC进行了优化的磁路。
It USES a series of removable clear aligners that are custom-molded to fit over your teeth.
这种矫正使用一套定制的完全适合你的牙齿的可移除的校准器。
Overpacking results from forcing too much material into the mold. The consequences of over packing are heavier parts and molded-in stress.
造成过度填充这个结果，是因为压迫太的塑料进入工模内。过度填充导致得到一个比较重的产品和需要一个大的注塑压力。
These superior quality Sensors which are used in Heart Monitoring and Bioinstrumentation Electrodes feature a non flaking coating that is uniformly distributed over the molded plastic substrate.
这些品质卓越的传感器应用在心脏监测和生物仪器电极，具有非剥落涂层并均匀地分布模压塑料基板上。
The same principle applies here as to stripping any internal undercut i. e. the molding must be free to expand during ejection to permit the molded undercut to ride over the restriction on the core.
相同的原理用到这儿关于推出任何内部模型凹穴，也就是说零件在顶出时必须能自由扩张答应形成的模型凹穴通过型芯的约束。
Introduction was made to a new kind of molded case circuit breaker over-current protection system.
介绍了一种新型塑料外壳式断路器的过电流保护系统。
The ferrule base (10) is molded over the collar (6).
该套管基部(10)模制在该套环(6)之上。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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