A new physical model for on-chip interconnect on high lossy substrate is proposed based on complex image theory and PEEC.

针对高损耗衬底，基于复镜像理论，结合部分元等效电路法，建立了一种新的片上互连线物理模型。

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The design and implementation of high speed low power VLSI structure and the analysis and design of high performance on-chip interconnect are two key fields of VLSI design.

高速低功耗VLSI结构的设计实现以及片内高性能互连线的分析设计是VLSI设计的两个关键领域。

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The design and implementation of high speed low power VLSI structure and the analysis and design of high performance on-chip interconnect are two key fields of VLSI design.

高速低功耗VLSI结构的设计实现以及片内高性能互连线的分析设计是VLSI设计的两个关键领域。

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