This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board.
用于挠性印刷线路板的具有基材的粘合片，其制造方法，多层挠性印刷线路板和挠性-刚性印刷线路板。
Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
The high voltage circuit breaker's condition messages are of multilayer and multifactor, so a layered evaluation indexs system is built in this paper.
根据高压断路器状态信息的多层次性和多因素性，建立高压断路器状态评估的层次型指标体系。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
An automatic routing program system for the wiring of multilayer printed-circuit backplanes is presented in this paper.
此文介绍一个多层印制底板自动布线程序系统。
An automatic routing program system for the wiring of multilayer printed-circuit backplanes is presented in this paper.
此文介绍一个多层印制底板自动布线程序系统。
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