The present invention provides a multichip package, including a plurality of storage chips and control chips.
本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。
Because the FT232 chips come with a unique serial number, you can identify the correct device within a multichip environment.
由于FT232芯片出场有一个自己的唯一的序号，你就可以在一个多芯片模块的环境下找出正确的设备。
A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules (MCMs).
本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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