Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。
The invention discloses a multi-resistance state resistor random-access memory unit and a preparation method thereof, and belongs to the technical field of microelectronics.
本发明公开了一种多阻态电阻随机存储器单元及其制备方法，属于微电子技术领域。
The invention discloses a multi-resistance state resistor random-access memory unit and a preparation method thereof, and belongs to the technical field of microelectronics.
本发明公开了一种多阻态电阻随机存储器单元及其制备方法，属于微电子技术领域。
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