Super speed on heat recovery and widely applied for multi-layer boards and regular uses.
超强回热特性， 补偿温度迅速，适用多层基板及常规使用。
Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area.
典型的多层建筑板采用电源平面将提供这种热蔓延而不需要额外的专用铜领域的能力。
Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area.
典型的多层建筑板采用电源平面将提供这种热蔓延而不需要额外的专用铜领域的能力。
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