Can be realized a multi-chip module, and one multi-machine.
可实现一模多片，一人多机。
This paper presented a new method for multi chip module routing.
对多芯片组件的布线方法提出了一种新的方法。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
The essay expounds a practical RFID system. The devise adopt the multi-pro IC chip S6700 produced by TI, MCU PIC16F877 and power magnifier module to realize long distance RFID system.
以射频识别技术的实际应用为背景，采用TI公司生产的多协议收发器芯片S6700，结合PIC16F877MCU和功率放大模块设计远距离阅读器。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
应用推荐