Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads.
在介质涂层上设置电路，后者包括芯片安装焊盘，连接焊盘和连接它们的电路迹线。
The other side of the mounting structure is mounted to the substrate, which also has bond pads.
安装结构的另一面被安装到基板，该基板也具有接合焊盘。
The other side of the mounting structure is mounted to the substrate, which also has bond pads.
安装结构的另一面被安装到基板，该基板也具有接合焊盘。
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