The surface of the molded package is textured when it is removed from the mold. The pin cavities are often very smooth as you can see in the previous picture.
芯片塑封后的表面从模具里取出来时是具有一定纹理的，指示引脚的凹槽通常都是很光滑的，就像你前面看到的图片一样。
The surface of the molded package is textured when it is removed from the mold. The pin cavities are often very smooth as you can see in the previous picture.
芯片塑封后的表面从模具里取出来时是具有一定纹理的，指示引脚的凹槽通常都是很光滑的，就像你前面看到的图片一样。
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