If you think American cooking means opening a food package and throwing the contents into the microwave, think again.
如果您以为美式烹饪就是打开包装将里面的东西放进微波炉加热，那您得改变想法了。
This paper described mainly study of package design and technology for high-reliability high - power microwave circuit.
本文叙述了高可靠大功率微波电路的封装设计及工艺研究情况。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
If you think American cooking means opening a package and tossing the contents into the microwave, think again.
如果你认为美国做饭意味着打开一个包，折腾的内容放进微波炉，再想想。
Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.
然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。
Then, package structure, especially the signal transmitting path structure is optimized using 3d electromagnetic simulation and microwave circuit theory. Effect of package lid is also studied.
然后通过三维电磁场仿真，并结合微波电路理论对封装结构，特别是高频信号传输路径进行了优化设计，另外对盖板的效应进行了定性分析。
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