In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
This paper introduce the application of micro assembly circuit micro module in microwave power amplifiers and its thermal management.
提出了微组装电路组件在微波功放控制电路中的应用，介绍了微组装电路组件的散热措施。
This paper mostly researches a pulse modulator which can be used in the microwave power module.
主要研究一种可用于微波功率模块的脉冲调制器。
The ripple has been proved by 3D beam-wave interaction simulator(BWIS) module of microwave tube simulator suite(MTSS), which was developed by University of Electronic Science and Technology of China.
利用电子科技大学编写的微波管模拟套装中的3维注-波互作用模块进行了静态轨迹计算，验证了理论推导。
So the module can be used as the simple source of microwave signals.
该模块可以作为一个简易的微波信号源。
From reliability and combination efficiency aspects, a 250w microwave solid-state PA module is designed and made by circuit design and CAD software simulation.
着重从可靠性和合成效率方面，利用电路设计手段和软件CAD仿真技术进行250w微波固态功放组件的研制。
A novel microstrip circuit was presented, and design method for X band microwave power module was introduced.
介绍了一种新颖X频段功放模块的设计方法和研制过程。
The problems of self-excitation and worsening of S-Parameter caused by structure of microwave active module always happen in the design of microwave circuits.
微波有源模块因为腔体的原因造成自激和传输参数的恶化一直是微波电路设计的难点之一。
This module of distributed parameters used in the lower microwave band is skillfully combined with an ultra-fine thin-film technology.
本文介绍一种将微波低频段分布参数电路与超微细薄膜工艺结合的微型化、低噪声、高选择性的放大模组。
This paper has introduced the thermal design and Electromagnetic Capability (EMC) related to the Reliability of Microwave Power Module (MPM).
本文阐述了与微波功率模块（MPM）可靠性有关的热设计及电磁兼容（EMC）设计。
This paper has introduced the thermal design and Electromagnetic Capability (EMC) related to the Reliability of Microwave Power Module (MPM).
本文阐述了与微波功率模块（MPM）可靠性有关的热设计及电磁兼容（EMC）设计。
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