The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
In the research on MB microsystem based on MEMS technology, the design and fabrication of a MB chip is the key process.
在基于MEMS技术的磁珠微系统的研究中，磁珠操控芯片的设计和制作工艺是其中的关键。
In the research on MB microsystem based on MEMS technology, the design and fabrication of a MB chip is the key process.
在基于MEMS技术的磁珠微系统的研究中，磁珠操控芯片的设计和制作工艺是其中的关键。
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