Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
微电子连接技术是微电子封装技术中的重要环节。
Microelectronics packaging machine control technology used in Japan to achieve a safe and unmanned operation, high productivity, greatly enhance the international competitiveness on the market.
日本用微电子技术控制包装机，达到安全性高、无人操作、高生产率，大大提高了国际市场竞争能力。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
The symposium is the annual meeting sponsored by the International Microelectronics and Packaging Society with hundreds of exhibitors and technical sessions.
本届研讨会是由国际微电子与封装协会主办的，每年一届，届时将有数百家参展商参加及很多技术会议。
The symposium is the annual meeting sponsored by the International Microelectronics and Packaging Society with hundreds of exhibitors and technical sessions.
本届研讨会是由国际微电子与封装协会主办的，每年一届，届时将有数百家参展商参加及很多技术会议。
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