Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
As the most important semiconductor material, silicon is playing a very important role in microelectronics field.
作为最重要的半导体材料，硅在微电子等领域具有不可替代的作用。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
BaTiO3-based thin film as a special material has penetrated into many parts of the science field land it has already been a basic tech for the microelectronics communication, sensor, optics.
钛酸钡系薄膜作为特殊形态的材料，已成为微电子、信息、传感器、光学、太等技术的基础，并广泛渗透到当前科技的各个领域。
Master or above major in Material Science or Applied Physics, Chemical Engineering, Microelectronics.
硕士及以上学历，材料科学、应用物理、化工、微电子等专业。
Master or above major in Material Science or Applied Physics, Chemical Engineering, Microelectronics.
硕士及以上学历，材料科学、应用物理、化工、微电子等专业。
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