IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
Flexible production line is a complex system integrating microelectronics, computer and systems engineering technology to satisfy automation and flexible machinery manufacturing.
柔性生产线是将微电子学、计算机和系统工程等技术有机地结合起来，解决机械制造自动化与柔性化的复杂系统。
Flexible production line is a complex system integrating microelectronics, computer and systems engineering technology to satisfy automation and flexible machinery manufacturing.
柔性生产线是将微电子学、计算机和系统工程等技术有机地结合起来，解决机械制造自动化与柔性化的复杂系统。
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