He has lots of original ideas about the research into microelectronics.
他对微电子学的研究很有创见。
If your project is developing an integrated circuit, you will have to take a module on advanced concepts in microelectronics.
如果你的项目是开发集成电路,你就必须学习一个课程,这个课程是关于微电子领域的先进概念。
During the year in Singapore the students will focus on microelectronics and mechatronics.
在新加坡理工学院受训的一年期间,将着重培养学员在微电子以及机电一体化方面的理论知识和技能。
For example, a paper about microelectronics could be tagged with that word — even if the term "microelectronics" does not appear in the content of the document itself.
例如,可以使用“微电子学”这个单词来标记一篇关于微电子学的文章,即使“微电子学”这个术语根本没有出现在文档本身的内容中。
Cylonlover writes "in a new, more efficient approach to solar powered microelectronics, researchers have produced a microchip which directly integrates photovoltaic cells."
cylonlover写道,“最近,旨在实现用太阳能作为电源的微电子技术的研究中,出现了一种更具效率的方案,研究者们制造出了直接集成了光电转换模块的芯片。”
Our goal is to become a leader in microelectronics manufacturing.
我们的目标是成为微电子制造的领军企业。
The foundation of microelectronics is modern solid state physics.
微电子学的基础是近代固体物理。
It would be a natural evolution of microelectronics to become nanoelectronics.
它是从微电子学到奈米电子学的自然演进。
Screen printing and thick film IC technology are the core of microelectronics.
丝网印刷与厚膜ic技术是微电子技术的核心技术之一。
This paper describes the method of metal tip fabrication for vacuum microelectronics.
介绍了真空微电子中金属尖阴极的制备方法。
Chip interconnection is an important part in the microelectronics parts manufacture process.
内引线连接是微电子器件制造过程中的重要环节之一。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
微电子连接技术是微电子封装技术中的重要环节。
P5 Engineers skilled in microelectronics and computer technology are developing artificial vision for robots.
在微电子和计算机技术上有专长的工程人员正研制机器人的人工视觉。
As the most important semiconductor material, silicon is playing a very important role in microelectronics field.
作为最重要的半导体材料,硅在微电子等领域具有不可替代的作用。
The apparatus adopts high-tech microelectronics technology development and production of high precision instrument.
本仪器系采用高新微电子技术研制和生产的高精度仪器。
During the last 10 years dramatic and rapid changes in Internet technologies and microelectronics have changed the world.
在刚过去的10年中,因特网技术和微电子技术的飞速发展改变了整个世界。
This paper gives an overview of SPM technology and its applications in microanalysis of microelectronics process and devices.
本文将介绍扫描探针显微镜及其在微电子工艺和器件微分析中的应用。
The rapid development of microelectronics and computer technology led to the rapid development of embedded systems technology.
微电子技术和计算机技术的迅猛发展带动了嵌入式系统技术的飞速发展。
With the rapid progress of microelectronics technology, it is undoubtedly that 21st century will be the century of information.
随着微电子技术的飞速发展,毫无疑问,21世纪将是信息的世纪。
Along with the rapid development of microelectronics and computer technology, embedded systems have been applied to many fields.
随着微电子和计算机技术的飞速发展,嵌入式系统被应用到众多领域。
Gene chip technology is the latest DNA analysis and examining technology which combined molecular biology with microelectronics.
基因芯片技术是近年来出现的分子生物学与微电子技术相结合的最新DNA分析检测技术。
Today, for example, problems are arising from new discoveries in the fields of nuclear physics, biological engineering and microelectronics.
例如,今天的核物理学、生物工程学、微电子学等专业领域中,由于有了新的发现,也就冒出了一些新的问题。
It is one of the most important and most mature compound semiconductor materials, mainly used in the field of optoelectronics and microelectronics.
它是目前最重要、最成熟的化合物半导体材料之一,主要应用于光电子和微电子领域。
With the rapid development of microelectronics, the feature size of semiconductor devices is becoming smaller and smaller as predicted by Moore's Law.
随着微电子技术的飞速发展,半导体器件的特征尺寸按摩尔定律不断缩小。
As the technology is making progress rapidly in microelectronics, the feature size has reduced below 130nm, and the 65nm process has been in practical use.
微电子技术飞速进步,工艺特征尺寸已经减小到了130纳米以下,65纳米工艺已成为成熟工艺。
As the core content of vacuum microelectronics, the performance of field emitter array (FEA) directly influences the whole performance of field emission device.
场发射阵列阴极(FEA)作为真空微电子学的核心内容,其性能的好坏直接影响着场发射器件的总体性能。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
At its Zurich Research Laboratory around 300 scientists representing over 20 nationalities concentrate on areas such as microelectronics, nanotechnology and computer security.
在其苏黎世研究实验室,来自20多个国家的约300位科学家主攻微电子学、纳米技术和计算机安全等领域。
应用推荐