Cathode is one of the core components of vacuum microelectronic devices.
阴极是真空微电子器件的核心部件之一。
Semiconductor silicon is the fundamental material for the microelectronic industry.
半导体硅材料是微电子产业的基础材料。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
Semiconductor silicon is the most fundamental material for the microelectronic industry.
半导体硅材料是微电子产业的基础材料。
Discrete device packaging is one of the basis and the pioneer of microelectronic technology.
分立器件封装也是微电子生产技术的基础和先导。
This suggests that if you designed microelectronic components carefully, you could reduce stiction.
这就意味着如果你的设计足够小心谨慎，那么这一部分的表面阻力是完全可以避免的。
The principle of the new microelectronic devices, spin transistor and spin valve transistor is reviewed.
介绍了新型微电子器件自旋晶体管和自旋阀晶体管的工作原理。
The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.
本文对微电子封装化学镀镍生产工艺及应用进行了研究。
The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.
应力是导致焊球失效的直接原因，进而致使器件失效。
The IC processing and device characteristic CAD system are very important parts in the microelectronic CAD system.
集成电路工艺及器件特性计算机辅助设计系统是微电子CAD系统的重要组成部分。
Information society is on the base of microelectronic industry that is built on the semiconductor silicon material.
微电子是信息社会的基础，而半导体硅材料则是微电子的支柱。
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
It is an urgent demand of new generation packaging materials with excellent properties in the microelectronic industry.
微电子行业迫切需要新一代优异性能的封装材料。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
主要用于微电子行业，被广泛应用于半导体器件、集成电路等分装材料。
The results are important for the understanding of the mechanism of material removal in the CMP of microelectronic materials.
其结果对于正确理解微电子材料cmp加工中的材料去除机理具有实际意义。
This paper describes a fabrication technology of metal tip field emission arrays (FEA) for the vacuum microelectronic devices.
本文介绍了真空微电子器件场发射金属尖阵列阴极的制备工艺技术。
Taking cellular phone for example, this article expounds the important role that microelectronic technology played in this course.
本文以蜂窝电话为例阐述了微电子技术在此进程中所起的重要作用。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
Points out that the environment parameters of high class clean rooms in a microelectronic factory directly affect the product quality.
指出超高级别微电子洁净厂房环境参数对产品质量至关重要。
And the silica sol prepared in lab and used in microelectronic industry is purified to 10 ~ -6. The purification mechanism is discussed.
然后对实验室制备的或在工业中已有应用的硅溶胶进行纯化，使其纯度达到10 -6级，并探讨了其纯化机理。
The ultra high pure hydrogen peroxide is one of the critical chemical materials for wet chemical process in the microelectronic industry.
超高纯过氧化氢试剂是微电子材料加工必需的关键电子化学品。
The application prospect of the transparent and conducting polyaniline films in optoelectronic and microelectronic devices is forecasted.
展望了透明导电聚苯胺薄膜在光电器件和微电子器件领域的应用前景。
This paper study and analysis microelectronic solid film construction and factor that effect the film resistor conductivity and constantity.
本文对微电子固体薄膜结构，以及影响薄膜电阻导电性和稳定性的因素进行了研究和分析。
With the rapid development of microelectronic technology in china, photolithographic equipments of high resolution and large field are demanded.
随着我国微电子技术的飞速发展，要求研制分辨率高、工作视场大的光刻设备。
To the problems occurring at using down hole mechanical sample noil and gas Wells, aptitude microelectronic high pressure sample has been studied.
针对油气井井下机械取样器在使用过程中出现的问题，研究开发出了智能型微电子高压物性取样器。
Study of neural dynamics with consideration of delays becomes particularly important in manufacturing high quality microelectronic neural networks.
要制造高质量的微电子神经网络，研究带有延时的神经动力行为是特别重要的。
Compared with semiconductor devices, vacuum microelectronic devices can work with higher frequency and larger power at a wider range of temperature.
真空微电子器件相对于半导体器件来说，有着更高的工作频率和输出功率，正常工作温度范围也相对较大。
Dielectric thin film was an important kind of electronic thin films, which has wide applications in microelectronic and photo-electronic technology.
介电膜，是一种重要的电子薄膜。在微电子技术和光电子技术中有着广泛的应用。
A process for the fabrication of Si cone cathode for the build up of vacuum microelectronic devices is proposed and its experimental results are given.
本文介绍了利用半导体硅材料制作的真空微电子器件的核心部件，场致发射硅锥阴极，的工艺研究及实验结果。
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