We developed a non silicon surface micro machining process with two or three mask electroplating layers and using polyimide or photoresist as sacrificial layers.
我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。
The fabricating process of the beam was designed after the micro -electroplating principle and the micro -electroplating plat form were introduced.
介绍了微电镀原理和设计了微电镀平台，设计了悬臂梁的微电镀工艺流程。
The fabricating process of the beam was designed after the micro -electroplating principle and the micro -electroplating plat form were introduced.
介绍了微电镀原理和设计了微电镀平台，设计了悬臂梁的微电镀工艺流程。
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