A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
The metal pattern formed on the circuit region or the display region is able to reflect light ray for identification device to identify.
该金属图案可形成于电路区中或显示区中，并可反射光线而供一辨识器材辨识之用。
The metal pattern formed on the circuit region or the display region is able to reflect light ray for identification device to identify.
该金属图案可形成于电路区中或显示区中，并可反射光线而供一辨识器材辨识之用。
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