Metal package with resistance welded.
电阻封焊式金属外壳。
Both our short-wavelength type and near infrared detection types are hermetically sealed in a metal package with a clear glass window.
我们的短波长型和近红外检测类型都密封在一个带有透明玻璃窗口的金属封装中。
And at a time when hobbyist computers were boxy wooden affairs with metal chassis, he designed the Apple II as a sleek, low-slung plastic package intended for the den or the kitchen.
在那个时代，业余爱好者的计算机就是四四方方的木头盒子加上一个金属底架，而他设计的AppleII，是圆滑矮小的塑料包，可以放在书房或者厨房。
the ‘horsey’ package includes wooden ornaments (horsey shape body), metal parts, and screws.
“Horsey”包括木制装饰品（马形身体）、金属配件和螺丝。
Introduce and release new plastic, metal and package materials.
导入和放行新的塑料、金属和包装等原材料。
Our separators are designed with retainer clips that are pre-positioned and welded to the flange and bottom plate to ensure metal to metal contact throughout the separator package.
我们分离的设计与剪辑聘有预先部署和焊接的法兰盘和底板，以确保金属接触整个分离器包。
Account of package materials of MEMS, including ceramics, plastic, metal material and metal compound material, etc was given.
本研究综述了MEMS的封装材料，包括陶瓷、塑料、金属材料和金属基复合材料等。
Wound with metalized polypropylene film as medium, metal coat as electrode, various outgoing modes and epoxy resin package.
金属化聚丙烯薄膜做介质，金属涂层作电极卷绕而成，多重引出方式环氧树脂包封。
Comparatively. the package box produced by the screen printing of imitating metal etched plate is quite different from the tradition's.
仿金属蚀刻网印技术生产的包装盒与传统的包装盒相比，有了质的飞跃。
The package includes a chip carrier which has a metal substrate.
所述封装包括有金属基片的芯片支座。
Product shape can be customized according to customer requirements: leaded package types, metal wrapper classes.
产品外形可以根据客户要求订做：引线封装类、金属外壳封装类。
The invention discloses a method for forming an insulating layer on a metal wire of a package.
本发明公开了一种在封装件的金属导线上形成绝缘层的方法。
Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.
采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
By simplifying the geometry model of the copper bus bar continuous extrusion process, based on a new metal forming simulation package, MSC.
对铜母线连续挤压过程的几何模型进行简化，基于MSC。
According to package characteristics of long linear HgCdTe IRFPA detector, difficulties of the metal split micro dewar manufacture are discussed in the paper.
针对长线列碲镉汞红外焦平面探测器封装的特点，文章讨论了分置式微型杜瓦研制的难点。
According to package characteristics of long linear HgCdTe IRFPA detector, difficulties of the metal split micro dewar manufacture are discussed in the paper.
针对长线列碲镉汞红外焦平面探测器封装的特点，文章讨论了分置式微型杜瓦研制的难点。
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