• He also has unexplained bleeding and complains about a metal chip in his neck.

    不明原因出血抱怨的脖子上的金属芯片

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  • The heat collecting principle of 2> superconducting heat pipe is to absorb heat through the metal chip, and heat damage will not affect the normal use.

    超导热管原理通过金属芯片吸收热量,利集热管损坏影响正常使用

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  • These metal impurities can also leach out, becoming an environmental pollutant when the chip is trashed at the end of its lifetime.

    芯片完成使命成为垃圾后,其里面金属杂质可以过滤出来,但会污染环境

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  • If you look at a (chip) packet, what you've got is a plastic film, a few layers of inks and a printed metal layer to keep the materials fresh.

    仔细观察一下(芯片)发现它们实际上就是一层层塑料膜构成,有的上面涂上颜色,有的上面镀上金属防止材料被腐蚀。

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  • Then the deformed metal (called chip) flows over the tool (rake) face.

    然后变形金属称为切屑流过刀具前倾

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  • By constructing a metal cutting model using slip-line field theory, chip curling radii are predicted theoretically in orthogonal cutting processes.

    通过采用滑移线理论建立正交切削模型使用这一模型,从理论上预测了切屑卷曲半径

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  • The metal foil chip resistance would be finished after taking the final process.

    接着,进行其它后续步骤完成金属芯片电阻器的制作。

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  • It is because the accumulated metal can be lumped in front of a discontinuous chip, a bue and a rounded cutting edge of a tool hence the formation of scale on the occasions.

    节状切屑屑瘤切削之所以导致鳞刺,完全由于它们前方都能形成层积金属

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  • In this paper, some questions such as metal cutting process and machining, chip formation and the function of cutting tool on cutting process have been studied, and some views were put forward.

    分析研究了切削中切削过程切削加工切屑形成刀具切屑形成过程中的作用

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  • Continuous chip. The continuous chip is characterized by a general flow of the separated metal along the tool face.

    连续切屑一般具有分离金属沿刀具流动特征。

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  • The package includes a chip carrier which has a metal substrate.

    所述封装包括金属基片芯片支座

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  • The top metal test pad, special test mode and BIST are adopted in the IC circuits to solve the IC test problem about the chip function test and electric character test.

    通过添加测试引脚、设计专用测试模式,内自测试等方法有效解决芯片电路功能测试电气性能测试。

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  • If there was a problem with the chip, you could probe the metal directly to watch the circuitry, and, with a focused-ion-beam system, you could even rewire it.

    如果芯片问题应该直接研究金属察看电路对于聚焦离子束系统则应该重新布线。

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  • Therefore, the metal oxide semiconductor can be used efficiently without additional manufacturing of a capacitor, and can save the chip size so as to reduce the cost.

    如此有效率地利用金属氧化物半导体无须另外制作电容,可节省芯片尺寸大小进而降低 成本。

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  • The invention disclosed a metal oxide semiconductor element with voltage stabilization and electrostatic discharge protection and a manufacturing method thereof, which is applied to a chip.

    发明公开了稳压静电放电防护金属氧化物半导体元件及其制造方法应用于一芯片。

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  • Base on chip L6561, a PFC preregulator for 400w metal halide lamp ballast is designed with wide input and output range.

    基于常用的L6561芯片设计输入输出范围的400金属卤化物电子镇流器功率因数校正电路。

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  • I have designed the multilayer chip inductor take this material as the foundation and discussed a little influences of the metal wire arrangement structure and via in the parameters of inductor.

    在以此材料基础设计了多层片式电感初步探讨了金属导线布置结构孔对电感元件一些参数影响

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  • The mass production of chip component tended to bond together each other and micro metal parts.

    应用粘结片式元器件微薄细小金属批量电镀。

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  • Sealing gel is dripped into the metal ring and filled around the silicon piezoresistive pressure sensor, so as to isolate the chip of the sensor from the outside environment.

    金属包封填充压力传感器四周,隔 绝传感器芯片外界环境的接触。

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  • These lights are applicable for the scratch inspection on metal, glass, film and chip surface.

    适用金属玻璃胶片晶片等平整表面划伤检测

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  • The forming mechanism of the cross section of unbroken metal fibers manufactured by the combined cutting of big inclination cutting and chip pulling cutting is analyzed.

    分析了采用刃倾角-拉屑复合切削方法制造连续型金属长纤维时纤维截面形成机理

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  • A method is introduced, which mix polyester chip and metal-oxide powder, then spin staple fibre, the fibre has antistatic property as its resistance is 1.

    通过在聚酯切片中加入金属氧化物母粒粉末制了永久性防静电纤维,其电阻值为1。

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  • An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

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  • The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.

    实用新型公开多芯片封装结构至少包括承载器、至少一封装模块绝缘层图案化金属层。

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  • The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.

    图案化金属位于绝缘层于导通中,以作为实用新型多芯片封装结构连线层。

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  • Cold beating lead screw plays the role of high-speed relative motion in the way of high-speed blowing shaft blanks, so that local plastic deformation forms a non-chip metal forming technique.

    打是工具和丝杠高速相对运动中,高速断续方式击打丝杠使丝杆轴坯局部塑性变形形成丝杠螺纹一种塑性成形技术

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  • Cold beating lead screw plays the role of high-speed relative motion in the way of high-speed blowing shaft blanks, so that local plastic deformation forms a non-chip metal forming technique.

    打是工具和丝杠高速相对运动中,高速断续方式击打丝杠使丝杆轴坯局部塑性变形形成丝杠螺纹一种塑性成形技术

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