By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
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