First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

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First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

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