I have used ~ as a placeholder for project top-level package.
我使用了~作为项目顶级程序包的占位符。
In this case, ReferenceStrength can be moved to a higher-level package using IntelliJ's refactoring tools.
在这种情况下，可以使用IntelliJ的重构工具把ReferenceStrength移到一个更高层次的包中。
The 3-d finite element model is built for the modal analysis of board-level package.
建立了板级封装的三维有限元模型并进行模态分析。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
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