The prime driving force adopting lead-free technology is the legislation and marketing advantage of green products.
环境法规及市场对绿色产品的需求，是采用无铅生产技术的主要动力。
Current status and trend of lead-free technology have been reviewed for electronic assembly manufacturing at home and abroad.
论述了国内外电子组装生产中无铅技术的现状及发展趋势。
We have nitrogen lead-free technology, special designs and advanced program software. So consumers ratify our products very well.
产品以高超的氮气无铅技术、独特的设计、强大先进的程序软件深受业界肯定。
Through the strict implementation of lead-free technology, we will continue to improve our product quality and continue to meet customer demand.
通过严格执行无铅工艺，我们将持续提高我们的产品品质，一如既往地满足客户的需求。
We take the lead in the industry because we have a team of resourceful technology and management experts who work in a stress-free environment and come out with endless new ideas.
我们不仅在专业领域里引领行业前进，更通过大批资深的技术和管理专家，在一个充满愉悦的工作氛围下，释放源源不绝的创造力。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
In the industry is the most modern of technology, the most powerful professional equipment manufacturers of lead-free.
在业界是最具现代之科技、最有实力的专业无铅设备生产商之一。
The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。
To provide the steady, reliable and environment protection lead-free reflow technology.
提供成熟、可靠、环保的无铅回流技术。
But the use of Lead-free soldering isn't widely received, due to lack of a accepted international standard, and influence of technology? Cost, etc.
但无铅化尚缺乏公认的国际标准，并受技术、成本等因素的影响，无铅焊接的推广没被广泛接受。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
The exploratory experiment of cyanide-free separating technology of lead-zinc in the slime for a concentration plant had been carried out.
对某选矿厂矿泥的无氰铅锌分离工艺进行了探索研究。
The present invention is lead-free soldering tin technology, and relates to soldering technology of electronic device and element.
一种无铅焊锡技术，涉及电子元件及器件用焊接用焊锡技术。
Green technology Manufactured with lead-free and halogen-free component packages.
绿色技术使用无铅和无卤素组件封装。
Green technology Manufactured with lead-free and halogen-free component packages.
绿色技术使用无铅和无卤素组件封装。
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