In 2004, Freescale joined STMicroelectronics, Infineon Technologies and Philips electronics NV in a consortium intended to promote lead-free packaging.
2004年，飞思卡尔加入旨在推动无铅封装的一个财团意法半导体，英飞凌科技和飞利浦电子公司。
The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.
着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。
The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.
在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。
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