Sony's FPA system for liquid crystal displays USES pre-tilting at a substrate alignment layer to arrange pixels in a near-vertical alignment.
索尼fpa液晶显示器系统在基质配向层使用了预倾斜技术，来将像素安排在一个近乎垂直的配向上。
By restricting knowledge of the system to a single layer, a boundary is placed on the overall system complexity, promoting substrate independence.
通过将系统知识限制在单个层，可以限制整个系统的复杂性，促进了底层的独立性。
The substrate, which has an adhesive backing, is made slightly larger than the final flexible display and the debonding layer, so it stays steady on the glass.
拥有粘性背面的基板比最后制成的软性显示器和离形层略大，以便让它固定在玻璃板上。
Hybrid FPA works the same way, but only USES pre-tilting on one side of the substrate alignment layer.
Hybrid FPA以同样的方式工作，但是只在一边的基质配向层使用了预倾斜。
Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device.
具有二氧化硅类玻璃薄层的无机基底，制备前述基底的方法，涂布剂和半导体器件。
For example, as shown in FIG. 8a, an oxide layer 810 optionally is patterned on a silicon substrate 820.
例如，如图8a所示，氧化层810选择性地在硅衬底820上形成图案。
The microstructure of surface Fe-based infiltrated layer on copper substrate and the bending behavior are investigated.
研究铜合金表面铁基渗层的微观组织以及铜基表面渗层的弯曲行为。
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高温低周疲劳条件下裂纹是在粘结层与高温合金基体的扩散层处。
Bonding force of substrate and adhesive layer is large. No adhesive failure occurs during storage and construction.
基材与胶层结合力大，在存放或施工过程中不存在脱胶现象。
It is pointed out that it is very important to control and adjust the residual stress formed in the interface to elevate the interface strength between the coating layer and the metal substrate.
指出抑制和调控界面层残余应力以提高其与基体金属间结合强度是关键环节。
By the design of the composition and structure of intermediate layer of the coating, the adhesive force between substrate and coating has been raised.
通过对过渡层成分及结构的设计，提高金属基体与涂层之间的结合强度。
The composition distribution, the phase analysis of the depositing layer and joint mechanism of the depositing layer to ceramic substrate are studied.
研究了复合渗镀机理、渗镀层成分和元素分布、渗镀层相结构以及渗镀层与基体的接合机理。
Selection of adhesive for bonding strength fi eld pull-out tests of thermal insulation layer and substrate was introduced.
介绍了在保温板材与基层的粘结强度现场拉拔试验中粘结剂的选用。
Above the substrate, the complex films include infrared reflectance layer, interference absorptive layers with different metal volume ratio, and anti-reflectance layer.
该复合膜从基底以上包括红外反射层、不同金属体积比干涉吸收层和减反射层。
In an embodiment, the method includes forming a gate dielectric layer on a semiconductor substrate.
实施例中，本方法包括在半导体衬底上形成栅极电介质层。
The features and microstructure of the cladding layer and interface layer between cladding layer and copper substrate were analyzed.
对熔覆层和熔覆层与基体结合区的形貌和微观组织进行了研究。
A contact (7) may include an electrical connection (70) between the substrate layer and the first layer.
接触(7)可以包括在衬底层和第一层之间的电连接(70)。
Both of the right and left charge storage regions having a thin oxide layer on the semiconductor substrate, a nitride layer on the thin oxide layer and an insulating oxide layer on the nitride layer.
左和右电荷存储区都具有半导体衬底上的薄氧化物层、薄氧化物层上的氮化物层和氮化物层上的绝缘氧化物层。
The results show that the shearing strength of the interface between clad layer and substrate is higher than of substrate and clad layer of some alloys.
熔覆层与基材交界处的剪切强度比热影响区高，并比某些合金的熔覆层高。
As an initial stage on the process of foamed nickel preparation, a layer with low phosphorus content nickel deposit is applied on polyurethane foam substrate as a conducting layer.
在制备泡沫镍材料的过程中，首先要求在聚氨酯海绵基体上低磷化学镀镍制备导电层。
The barrier layer is positioned on the substrate.
所述阻绝层位于所述底材上。
The substrate structure comprises a substrate layer and a substrate tie layer.
基片结构物包括基片层和基片粘结层。
The one or more intermediate conductive layers are formed between the top conductive layer and the substrate.
一层或多层中间导电层形成于顶部导电层和衬底之间。
The influence of the crystal orientation of the substrate on microstructure is investigated by multi layer laser cladding with the powder of nickel base superalloy.
采用镍基合金粉，研究了激光多层涂覆过程中基材晶体取向对涂层凝固组织的影响规律。
The microstructure of the ceramic layer is columnar and its growth direction is perpendicular to the substrate surface.
陶瓷熔覆层的组织为柱状晶。其生长方向与基体表面垂直。
A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
The preparation of ternary boride hard alloy cladding layer on steel substrate is studied.
研究采用铸渗法制备三元硼化物硬质合金覆层钢基材料。
Among them, the active component on the substrate has an insulating layer.
其中，位于基板上的主动元件具有一绝缘层。
Among them, the active component on the substrate has an insulating layer.
其中，位于基板上的主动元件具有一绝缘层。
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