Introduces the principle of the tin-ball laser bonding on hard disk sliders and its merit.
介绍硬盘磁头激光锡球焊接的原理和优点；
A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一种激光焊接装置，能够迅速且方便地进行带覆层导线的覆层除去作业、对该带覆层导线和端子的激光焊接作业。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
It is shown that using the same laser parameter has effect on bonding quality of surfacing and matrix with different layers by optical microcope, microhardness.
对覆层与基体结合机理进行了分析，发现随着堆焊层数的增加，激光堆焊对基材与覆层过渡区有加大的影响。
Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency.
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。
The bioceramic coating by laser cladding has high bonding strength and e.
介绍了在奥氏体不锈钢基材上激光涂覆生物陶瓷涂层的研究结果。
Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.
激光局部键合是有效降低键合温度的一种重要工艺。
The results showed that there were two kinds of defects, porosity and ill bonding in the laser multi-layer cladding.
结果发现，成形件内部存在两种类型的缺陷，即气孔和熔合不良。
In the design of the semiconductor laser groupware, selection of lasers, design of an optical system and a laser circuit and the bonding technology are key factors.
在半导体激光器模组设计中，激光器选择、光学系统设计、激光器电路设计与“邦定”技术是模组设计的关键部分。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
EDS spectrum analysis found that the process of laser cladding elements occurred in the proliferation of cladding layer and the substrate to achieve a good metallurgical bonding.
EDS能谱分析发现在激光熔覆的过程中发生了元素扩散，熔覆层与基体实现了良好的冶金结合。
The results show that the microstructure of laser alloying zone is compact, grain is fine, and has metallurgical bonding with matrix.
实验表明：激光合金化层组织致密，晶粒细化，与基体呈冶金结合。
The results show that the microstructure of laser alloying zone is compact, grain is fine, and has metallurgical bonding with matrix.
实验表明：激光合金化层组织致密，晶粒细化，与基体呈冶金结合。
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