The factors affecting the junction-to-case thermal resistance of the module are studied according to the simulation results.
根据该热模型分析了评价集成模块热性能的主要参数——模块的结壳热阻的构成情况和影响因素；
The factors affecting the junction-to-case thermal resistance of the module are studied according to the simulation results.
根据该热模型分析了评价集成模块热性能的主要参数——模块的结壳热阻的构成情况和影响因素；
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