And all of the foundries utilize similar equipment, which includes deep reactive ion etch tools and wafer bonders.
所有芯片制造厂都使用类似的设备，包括深反应离子蚀刻工具和晶片键合机。
The influence of chamber pressure, gas flow rate and RF power on micro loading effect in reactive ion etch of silicon dioxide is researched.
对二氧化硅反应离子刻蚀中反应室压力，刻蚀气体流量和射频功率等因素对刻蚀速率和刻蚀均匀性的影响进行了研究。
Last, a technique known as anisotropic ion beam milling (IBM) is used to etch through the mask to make an array of holes, creating the nanoporous metal.
最后，采用各项异性的离子束(IBM)加工技术可以通过掩膜来蚀刻孔阵，以制成纳米多孔金属材料。
Last, a technique known as anisotropic ion beam milling (IBM) is used to etch through the mask to make an array of holes, creating the nanoporous metal.
最后，采用各项异性的离子束(IBM)加工技术可以通过掩膜来蚀刻孔阵，以制成纳米多孔金属材料。
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