The real contact area of the bond interface and the cross-sectional deformation of the bond wire were the causations respectively for the fluctuation and wholly increase of the resistance.
接头界面有效连接面积和接头上引线横截面变形量的变化分别是造成接头电阻波动性和整体增大趋势的原因。
The thermal interface material provided by the invention has the characteristics of low thermal contact resistance and high heat-conducting efficiency.
本发明提供的热界面材料具有接触热阻小，导热率高的特点。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
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