An interconnection structure is formed through the buried insulating layer to connect the integrated inductor to the integrated circuit.
形成穿过掩埋绝缘层的互连结构，以连接集成电感器和集成电路。
An interconnection structure is formed through the buried insulating layer to connect the integrated inductor to the integrated circuit.
形成穿过掩埋绝缘层的互连结构，以连接集成电感器和集成电路。
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