The influence of parasitic interconnect capacitance is much in evidence with the progress of the semiconductor techniques and the increase of chip density and calculated speed.
随着半导体工艺的进步，芯片集成度和运算速度的提高，互连寄生效应的影响也日益明显。
Very small, high density interconnect with twist pin contact for demanding digital applications including medical, instrumentation and satellite systems. Versions to meet MIL-C-83513 specifications.
外壳尺寸小，高密封性，麻花针接触端子，应用在医疗，仪器仪表和数字卫星系统等领域。符合MIL-C-83513标准。
Very small, high density interconnect with twist pin contact for demanding digital applications including medical, instrumentation and satellite systems. Versions to meet MIL-C-83513 specifications.
外壳尺寸小，高密封性，麻花针接触端子，应用在医疗，仪器仪表和数字卫星系统等领域。符合MIL-C-83513标准。
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