The method comprises a step of removing a thin slice of the integrated circuit chip from part of the thickness along the direction vertical to the structure length.
所述方法包括以沿垂直于所述结构长度的方向的方式从所述厚度 的部分去除一所述集成电路芯片的薄片。
The method also provides an integrated circuit chip with a thickness, a width and a length.
所述方法也提供具有厚度、宽度和长度的集成电路芯片。
The method also provides an integrated circuit chip with a thickness, a width and a length.
所述方法也提供具有厚度、宽度和长度的集成电路芯片。
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