In semiconductor receivers transistors take the place of vacuum tubes.
在半导体收音机中晶体管代替了真空管。
A typical application in semiconductor machine has been illustrated.
并且用图表说明了半导体机械中的一种典型的应用。
The motion of electrons or holes in semiconductor in electric field.
半导体中电子或空穴在电场中的运动。
This is a survey lecture on energy transport models in semiconductor science.
这是一篇关于半导体材料科学中能量输运模型的综述性文章。
That allows it to piggyback on the continuous improvement in semiconductor technology.
这使得它搭载的半导体技术的不断改进。
This paper introduces SIMS applications in semiconductor discrete component dissector .
本文介绍SIMS技术在半导体分离器件剖析中的应用。
The properties of the effective mass of polaron in semiconductor quantum dot are studied.
研究了半导体量子点中极化子的有效质量。
Plasma processing technology is a new technology developed in semiconductor manufacturing.
等离子体加工技术是在半导体制造中创立起来的一种新技术。
Phase noise in semiconductor laser due to external optical feedback is investigated theoretically.
本文在理论上研究了由于外部光反馈引起的半导体激光器的相位噪声。
LOCOS is the mature technology, which is used widely for the isolation in semiconductor micron times.
硅的局域氧化工艺是一个非常成熟的工艺,在微米时代有着广泛的应用。
A method for measuring the relaxation oscillation effect in semiconductor DH lasers has been suggested.
本文介绍了半导体dH激光器张弛振荡效应的测试原理与方法。
The field-enhanced carrier generation of deep level centers in semiconductor space charge region has been studied.
本文研究了半导体表面空间电荷区中的深能级中心的电场增强载流子产生效应;
The materials can be made in a variety of morphologies and could be used in semiconductor devices, optics or batteries.
这种纳米材料可以制成不同的形态,能用于半导体、光学、电池等领域。
Silicone resin modified polyester(SP) is a kind of ultra-pure surface protection material used in semiconductor device.
聚酯改性硅漆(SP)是用于硅器件表面保护的高纯绝缘材料。
An instrument based on area array CCD devices for measuring stresses in semiconductor materials is studied and realized.
研究和实现了采用面阵CCD器件的半导体材料应力测试仪。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
The element is used to harden certain steels, among other metallurgical uses, and is also used in semiconductor devices.
广泛用于提高钢的淬硬性以及其它冶金工业,也用作半导体。
Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability.
树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。
It was early in the semiconductor manufacturing has been widely used, is an indispensable process in semiconductor manufacturing.
它早在半导体制造中得到了广泛应用,是半导体制造不可缺少的工艺。
From the Ct transient curve obtained experimentally, the minority carrier generation lifetime in semiconductor can be determined.
根据扫描所得的电容-时间瞬态曲线,可确定样品中少于产生寿命。
Discusses the gold diffusing with gold chloric acid substituted for gold evaporation habitually used in semiconductor technology.
探讨采用氯金酸金扩散代替惯用的蒸金扩散工艺。
It can be used for investigation to detect defects and shallow impurities, and to show their distributions in semiconductor materials.
它可以用来探测材料中的缺陷及浅能级杂质,显示其分布。
Mainly the author of this essay elaborates that Taguchi parameter design controls the linewidth quality in semiconductor manufacturing.
本文着重论述了田口式参数设计法在半导体制造中对线宽的质量控制。
The paper describes the mechanisms of metal-semiconductor contact and the actual applications of this contact in semiconductor technology.
本文评述了金属-半导体接触的各种机理以及这个接触在半导体枝术中的实际应用。
The world leading place in semiconductor industry made Japan have a solid foundation of components for active phased array radar development.
日本半导体工业在世界上的领先地位为其研制有源相控阵雷达提供了扎实的器件基础。
In this paper, a method of chaotic controlling is presented via controlling the phase in semiconductor lasers under to external optical injection.
提出外部光注入半导体激光器混沌相位控制方法,通过周期调制注入光的相位相移将激光器的混沌控制到多种周期状态。
The most established way in semiconductor industry to create such support is the temporary mounting of those materials to rigid carrier substrates.
半导体行业中建造这种支持最公认的方法是临时固定这种衬底材料到刚性载体基底上。
There, he and his colleagues devised a scheme to marry photolithography, a technology used in semiconductor fabrication, to combinatorial chemistry.
正是在那,他与他的研究人员一起将用于半导纤维的技术-影像平面印刷技术与组合化学嫁接到了一起。
In the paper, the properties of weak-coupling exciton in semiconductor quantum dot are studied by using the method of a linear-combination operator.
采用线性组合算符方法研究了半导体量子点中弱耦合激子的性质。
The silicon in semiconductor components has to be mono crystalline: it has to have a very pure crystal form without defects in the crystal structure.
硅在半导体元件要单结晶:它需要有一个非常纯净的晶体形式,如果没有缺陷的晶体结构。
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