Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
Mobile power sets of materials, batteries, programs, wire, packaging, PCBA, lithium battery management IC;
移动电源套料，电芯，方案，线材，包装，PCBA、锂电池管理IC；
Mobile power sets of materials, batteries, programs, wire, packaging, PCBA, lithium battery management IC;
移动电源套料，电芯，方案，线材，包装，PCBA、锂电池管理IC；
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