With the development of the IC manufacturing technology, the IC companies have to consider how to manage the whole operation of these high-tech and high-precision companies.
在大力发展IC制造技术的同时，各个集成电路企业不得不考虑如何管理好这工艺技术复杂，工艺精度高的企业的整体运作。
With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.
随着集成电路(IC)制造技术的飞速发展，为了进一步增加IC芯片的产量和降低单元制造成本，硅片趋向大直径化。
As one of the common frontier technology of IC manufacturing, micro-manufacturing, and robot manipulation, microassembly and micromanipulation have been researched widely recently.
微装配是电子制造、微制造、机器人操作等制造领域的共性前沿技术之一，近年来得到了广泛的研究与应用。
IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前，化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。
At present, both integrated circuit computer-aided design (IC-CAD) technology and integrated circuit computer-aided manufacturing technology in our country are inferior to that of advanced country.
如果说目前我国集成电路的计算机辅助设计技术同世界先进国家相比存在着多年差距，那么，在制造方面的计算机辅助也同样存在很大的差距。
At present, both integrated circuit computer-aided design (IC-CAD) technology and integrated circuit computer-aided manufacturing technology in our country are inferior to that of advanced country.
如果说目前我国集成电路的计算机辅助设计技术同世界先进国家相比存在着多年差距，那么，在制造方面的计算机辅助也同样存在很大的差距。
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