IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.
设计制造出IC芯片粘片机焊头机构的实验平台，采用图像处理的方式来测量焊头的运动精度和定位精度等参数。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
The designers of these circuits based them on the same concept: a fully integrated, single-die-IC switching regulator and a micropower operational amplifier.
些电路的设计者们在设计时都有同样的观念：完整的单一模式集成电路继电器和微功率运放。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
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