A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.
本文首次利用时域有限差分(FDTD)法分析了高速集成电路芯片内半导体基片上的有耗互连传输线的电特性。
The device could shape the future of high-speed signal processing, integrated circuits, optical communications, supercomputing and other applications.
该装置可以将高速信号处理，集成电路，光通信，超级计算和其它应用的未来具体化。
The high-speed digital frequency mixer made of medium-scale integrated circuits and the design of a high power transistor amplifier are also presented.
介绍了高速中规模集成数字频率合成器、晶体管高频大功率放大器的设计。
The method has advantages of simplicity, easy to use, small size, high tuning speed and easy to be integrated with circuits.
这种调谐方法具有结构简单、使用方便、体积小、调谐速度快、易于与电子线路集成等优点。
The electric properties of interconnects and packaging are very important for the performance of high-speed integrated circuits.
互连封装结构的电特性对当前高速电路系统的总体性能具有至关重要的作用。
The electric properties of interconnects and packaging are very important for the performance of high-speed integrated circuits.
互连封装结构的电特性对当前高速电路系统的总体性能具有至关重要的作用。
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