For high pin-count products, some cases were illustrated using common ground connection and separating the ESD tests to overcome the limitations on SB available leads.
对于一些多管脚芯片产品,举例说明了一种共地连接、分组测试的方法,克服了该封装有管脚数量限制的局限性。
For high pin-count products, some cases were illustrated using common ground connection and separating the ESD tests to overcome the limitations on SB available leads.
对于一些多管脚芯片产品,举例说明了一种共地连接、分组测试的方法,克服了该封装有管脚数量限制的局限性。
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